How does the new heat dissipation system in the Galaxy S25 prevent overheating

Key Features of the Heat Dissipation System

1. Larger Vapor Chamber:
- The Galaxy S25 and S25+ feature a vapor chamber that is 15% larger than that of their predecessors, while the S25 Ultra boasts an impressive 40% larger vapor chamber. This increase in size allows for more efficient heat distribution and dissipation across the device[1][5][7].

2. Thermal Interface Material (TIM):
- A new tailored thermal interface material has been introduced, which envelops the chipset. This material improves thermal conductivity, allowing heat to be transferred away from the processor more effectively and reducing the likelihood of overheating during intensive tasks such as gaming or video processing[6][9].

3. Heat Distribution Mechanism:
- The design of the cooling system ensures that heat dissipated from the Snapdragon chip is spread throughout the device, preventing localized hot spots that could make the phone feel excessively warm to the touch. This approach helps maintain performance without rapid throttling under load[3][4].

4. Performance Optimization:
- With these enhancements, the Galaxy S25 series is better equipped to sustain high performance over extended periods without overheating. The improved cooling system allows users to engage in processor-intensive applications while minimizing thermal issues, thus enhancing overall user experience[1][3][7].

In summary, the Galaxy S25's new heat dissipation system leverages a larger vapor chamber and advanced thermal materials to effectively manage heat, ensuring optimal performance even under heavy usage conditions.